HOT MELT ADHESIVE

Low application temperature hot melt packaging adhesives comprising vegetable derived wax such as a soy wax are described. L'invention concerne des adhésifs d'emballage thermofusible à faible température d'application comprenant une cire dérivée de végétaux telle que de la cire de soj...

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Main Authors GONG, LIE-ZHONG, HANER, DALE, L
Format Patent
LanguageEnglish
French
Published 09.10.2008
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Abstract Low application temperature hot melt packaging adhesives comprising vegetable derived wax such as a soy wax are described. L'invention concerne des adhésifs d'emballage thermofusible à faible température d'application comprenant une cire dérivée de végétaux telle que de la cire de soja.
AbstractList Low application temperature hot melt packaging adhesives comprising vegetable derived wax such as a soy wax are described. L'invention concerne des adhésifs d'emballage thermofusible à faible température d'application comprenant une cire dérivée de végétaux telle que de la cire de soja.
Author HANER, DALE, L
GONG, LIE-ZHONG
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DocumentTitleAlternate ADHÉSIF THERMOFUSIBLE
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RelatedCompanies NATIONAL STARCH AND CHEMICAL COMPANY INVESTMENT HOLDING CORPORATION
HANER, DALE, L
GONG, LIE-ZHONG
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Snippet Low application temperature hot melt packaging adhesives comprising vegetable derived wax such as a soy wax are described. L'invention concerne des adhésifs...
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SubjectTerms ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
Title HOT MELT ADHESIVE
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