HOT MELT ADHESIVE

Low application temperature hot melt packaging adhesives comprising vegetable derived wax such as a soy wax are described. L'invention concerne des adhésifs d'emballage thermofusible à faible température d'application comprenant une cire dérivée de végétaux telle que de la cire de soj...

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Bibliographic Details
Main Authors GONG, LIE-ZHONG, HANER, DALE, L
Format Patent
LanguageEnglish
French
Published 09.10.2008
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
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Summary:Low application temperature hot melt packaging adhesives comprising vegetable derived wax such as a soy wax are described. L'invention concerne des adhésifs d'emballage thermofusible à faible température d'application comprenant une cire dérivée de végétaux telle que de la cire de soja.
Bibliography:Application Number: WO2008US59087