APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

Provided is a mounting apparatus for mounting a plurality of TCPs on a side portion of a substrate. The mounting apparatus is provided with punching apparatuses (3A, 3B) for punching out the TCPs (2) from a carrier tape (1); receiving/transferring means (4A, 4B) for receiving the TCPs punched out by...

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Main Author HIROSE, KEIGOU
Format Patent
LanguageEnglish
French
Japanese
Published 28.08.2008
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Abstract Provided is a mounting apparatus for mounting a plurality of TCPs on a side portion of a substrate. The mounting apparatus is provided with punching apparatuses (3A, 3B) for punching out the TCPs (2) from a carrier tape (1); receiving/transferring means (4A, 4B) for receiving the TCPs punched out by the punching apparatus and transferring them to a prescribed position; index means (5A, 5B) which have a plurality of first holding heads (6) for receiving and holding the TCPs transferred by the receiving/transferring means; buffer means (31A, 31B) having a second holding head (34) for receiving and holding the TCPs held by a first holding head of the index means; and mounting heads (36A, 36B) for receiving the TCPs stored in the buffer means and mounts them on the side portion of the substrate. L'invention concerne un appareil de montage pour monter une pluralité de TCP sur une partie latérale d'un substrat. L'appareil de montage comporte des appareils de poinçonnage (3A, 3B) pour poinçonner les TCP (2) à partir d'une bande support (1) ; des moyens de réception/transfert (4A, 4B) pour recevoir les TCP poinçonnés par l'appareil de poinçonnage et les transférer à une position prescrite ; des moyens d'indice (5A, 5B) ayant une pluralité de premières têtes de support (6) pour recevoir et supporter les TCP transférés par les moyens de réception/transfert ; des moyens de tampon (31A, 31B) ayant une seconde tête de maintien (34) pour recevoir et supporter les TCP supportés par une première tête de support des moyens d'indice ; et des têtes de montage (36A, 36B) pour recevoir les TCP stockés dans les moyens de tampon et les monter sur la partie latérale du substrat.
AbstractList Provided is a mounting apparatus for mounting a plurality of TCPs on a side portion of a substrate. The mounting apparatus is provided with punching apparatuses (3A, 3B) for punching out the TCPs (2) from a carrier tape (1); receiving/transferring means (4A, 4B) for receiving the TCPs punched out by the punching apparatus and transferring them to a prescribed position; index means (5A, 5B) which have a plurality of first holding heads (6) for receiving and holding the TCPs transferred by the receiving/transferring means; buffer means (31A, 31B) having a second holding head (34) for receiving and holding the TCPs held by a first holding head of the index means; and mounting heads (36A, 36B) for receiving the TCPs stored in the buffer means and mounts them on the side portion of the substrate. L'invention concerne un appareil de montage pour monter une pluralité de TCP sur une partie latérale d'un substrat. L'appareil de montage comporte des appareils de poinçonnage (3A, 3B) pour poinçonner les TCP (2) à partir d'une bande support (1) ; des moyens de réception/transfert (4A, 4B) pour recevoir les TCP poinçonnés par l'appareil de poinçonnage et les transférer à une position prescrite ; des moyens d'indice (5A, 5B) ayant une pluralité de premières têtes de support (6) pour recevoir et supporter les TCP transférés par les moyens de réception/transfert ; des moyens de tampon (31A, 31B) ayant une seconde tête de maintien (34) pour recevoir et supporter les TCP supportés par une première tête de support des moyens d'indice ; et des têtes de montage (36A, 36B) pour recevoir les TCP stockés dans les moyens de tampon et les monter sur la partie latérale du substrat.
Author HIROSE, KEIGOU
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DocumentTitleAlternate APPAREIL ET PROCÉDÉ POUR LE MONTAGE D'UN COMPOSANT ÉLECTRONIQUE
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RelatedCompanies SHIBAURA MECHATRONICS CORPORATION
HIROSE, KEIGOU
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Snippet Provided is a mounting apparatus for mounting a plurality of TCPs on a side portion of a substrate. The mounting apparatus is provided with punching...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Title APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
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