THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE OBTAINED WITH THE SAME

• Main Authors: AKIYAMA, MASANORI, TSUCHIKAWA, SHINJI, KOTAKE, TOMOHIKO
• Format: Patent
• Language: English; French; Japanese
• Published: 10.04.2008
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

A thermosetting resin composition which comprises (A) a hardener having an acid substituent and an unsaturated maleimide group and produced by a specific process, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin having a specific monomer unit, and (D) an epoxy resin...