SCRIBING METHOD, SCRIBING APPARATUS, AND SCRIBED SUBSTRATE SCRIBED BY THE METHOD OR APPARATUS
Enabled is to form a scribing line for obtaining a laser-split substrate, in an object substrate with a relatively low carbide tool pushing force or laser energy. Provided is a scribing method for forming a scribing line (S) along a splitting line (J) of a substrate (K) to be split, before a splitti...
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Main Authors | , , , , |
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Format | Patent |
Language | English French Japanese |
Published |
25.10.2007
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Abstract | Enabled is to form a scribing line for obtaining a laser-split substrate, in an object substrate with a relatively low carbide tool pushing force or laser energy. Provided is a scribing method for forming a scribing line (S) along a splitting line (J) of a substrate (K) to be split, before a splitting step of splitting the substrate (K). In this scribing method, a first laser beam (L1) is relatively moved at first along the splitting line (J) of the substrate (K), to form an internal modified layer (N) along the splitting line (J) of the substrate (K), in the substrate (K), and then the scribing line (S) along the splitting line (J) of the substrate (K), in the surface of the substrate (K). Prior to the formation of the scribing line (S), the internal modified layer (N) is formed in advance in the substrate (K) with the first laser beam (L1), so that the scribing line (S) more sufficiently deeper for splitting the substrate (K) than that of the case of no internal modified layer (N) can be formed with a lower energy.
L'invention permet de former une ligne de traçage pour obtenir un substrat fendu par laser, dans un substrat d'objet avec une énergie laser ou une force de poussée d'outil en carbure relativement faible. L'invention concerne un procédé de traçage permettant de former une ligne de traçage (S) le long d'une ligne de séparation (J) d'un substrat (K) à fendre, avant une phase de séparation consistant à fendre le substrat (K). Selon ce procédé de traçage, un premier faisceau laser (L1) se déplace d'abord de manière relative le long de la ligne de séparation (J) du substrat (K), pour former une couche modifiée interne (N) le long de la ligne de séparation (J) du substrat (K), dans le substrat (K), puis pour former la ligne de traçage (S) le long de la ligne de séparation (J) du substrat (K), dans la surface du substrat (K). Avant la formation de la ligne de traçage (S), la couche modifiée interne (N) est formée par avance dans le substrat (K) avec le premier faisceau laser (L1), de sorte que la ligne de traçage (S), ayant une profondeur suffisante pour fendre le substrat (K) et étant plus profonde que dans le cas sans couche modifiée interne (N), puisse être formée avec une énergie réduite. |
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AbstractList | Enabled is to form a scribing line for obtaining a laser-split substrate, in an object substrate with a relatively low carbide tool pushing force or laser energy. Provided is a scribing method for forming a scribing line (S) along a splitting line (J) of a substrate (K) to be split, before a splitting step of splitting the substrate (K). In this scribing method, a first laser beam (L1) is relatively moved at first along the splitting line (J) of the substrate (K), to form an internal modified layer (N) along the splitting line (J) of the substrate (K), in the substrate (K), and then the scribing line (S) along the splitting line (J) of the substrate (K), in the surface of the substrate (K). Prior to the formation of the scribing line (S), the internal modified layer (N) is formed in advance in the substrate (K) with the first laser beam (L1), so that the scribing line (S) more sufficiently deeper for splitting the substrate (K) than that of the case of no internal modified layer (N) can be formed with a lower energy.
L'invention permet de former une ligne de traçage pour obtenir un substrat fendu par laser, dans un substrat d'objet avec une énergie laser ou une force de poussée d'outil en carbure relativement faible. L'invention concerne un procédé de traçage permettant de former une ligne de traçage (S) le long d'une ligne de séparation (J) d'un substrat (K) à fendre, avant une phase de séparation consistant à fendre le substrat (K). Selon ce procédé de traçage, un premier faisceau laser (L1) se déplace d'abord de manière relative le long de la ligne de séparation (J) du substrat (K), pour former une couche modifiée interne (N) le long de la ligne de séparation (J) du substrat (K), dans le substrat (K), puis pour former la ligne de traçage (S) le long de la ligne de séparation (J) du substrat (K), dans la surface du substrat (K). Avant la formation de la ligne de traçage (S), la couche modifiée interne (N) est formée par avance dans le substrat (K) avec le premier faisceau laser (L1), de sorte que la ligne de traçage (S), ayant une profondeur suffisante pour fendre le substrat (K) et étant plus profonde que dans le cas sans couche modifiée interne (N), puisse être formée avec une énergie réduite. |
Author | INAKA, CHISA UCHIKATA, TOMOO UEHARA, YUKIHIRO TAHARA, TAKANORI MURATA, HIROYUKI |
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DocumentTitleAlternate | procédé de traçage, appareil de traçage, et substrat trusquiné selon le procédé ou appareil |
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SubjectTerms | CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS |
Title | SCRIBING METHOD, SCRIBING APPARATUS, AND SCRIBED SUBSTRATE SCRIBED BY THE METHOD OR APPARATUS |
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