MULTI DEVICE COOLING

• Main Authors: UPADHYA, GIRISH, WERNER, DOUGLAS, E, MUNCH, MARK
• Format: Patent
• Language: English; French
• Published: 20.11.2008
• Subjects: BLASTING; CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; COUNTING; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEATGENERATING MEANS, IN GENERAL; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL ENGINEERING; PHYSICS; PRINTED CIRCUITS; RANGES; VENTILATING; WEAPONS

A micro scale cooling system comprises a first heat exchanger (120) thermally coupled to a first heat source (115). The cooling system also has a second heat exchanger (130) thermally coupled to a second heat source ( 125) and a connection between the first heat exchanger and the second heat exchang...