INSULATING SHEET FOR CONDUCTING BONDING SHEET, CONDUCTING BONDING SHEET, METHOD FOR MANUFACTURING CONDUCTING BONDING SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPOUND COMPONENT

• Main Authors: AMAGAI, MASAZUMI, WATANABE, MASAKO, SHIMAMURA, MASATO, YAMAZAKI, OSAMU, KAWAMATA, YUJI, SHINODA, TOMONORI, TASHIMA, TAKESHI, SAIKI, NAOYA, FURUDATE, MASAAKI
• Format: Patent
• Language: English; French; Japanese
• Published: 03.05.2007
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; CURRENT COLLECTORS; DYES; ELECTRICITY; INSULATORS; LINE CONNECTORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS AS ADHESIVES

An insulating sheet for conducting bonding sheets, which has an adhesive layer that can hold at least one layer of conducting particles, a conducting bonding sheet using such insulating sheet, and an electronic compound component using such conducting bonding sheet. Provided are the insulating sheet and the conducting bonding sheet which firmly hold the arranged conducting particles and can prevent the particles from dropping, a method for manufacturing such conducting bonding sheet, and a method for manufacturing the electronic compound component using such conducting bonding sheet. Cette invention concerne une feuille isolante destinée à des feuilles de liaison conductrices, comprenant une couche adhésive qui peut retenir au moins une couche de particules conductrices, une feuille de liaison conductrice utilisant une telle feuille isolante, et un composant électronique utilisant une telle feuille de liaison conductrice. Cette invention concerne la feuille isolante et la feuille de liaison conductrice qui retiennent bien les particules conductrices agencées et permettent d'éviter leur chute, ainsi qu'un procédé de fabrication d'une telle feuille de liaison conductrice et un procédé de fabrication d'un composant électronique utilisant cette feuille de liaison conductrice.