METHOD AND DEVICE FOR FORMING SOLDER BUMP
[PROBLEMS] To form pad electrodes at a fine interval, and to obtain bumps having sufficient quantity of solder and having less variation. [MEANS FOR SOLVING PROBLEMS] A board (20) is positioned, at first, in inert gas (13) within a gas tank (11) with its surface (21) facing upward. Then, the inert g...
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| Main Authors | , , |
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| Format | Patent |
| Language | English French Japanese |
| Published |
01.06.2006
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| Online Access | Get full text |
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| Abstract | [PROBLEMS] To form pad electrodes at a fine interval, and to obtain bumps having sufficient quantity of solder and having less variation. [MEANS FOR SOLVING PROBLEMS] A board (20) is positioned, at first, in inert gas (13) within a gas tank (11) with its surface (21) facing upward. Then, the inert gas (13) containing fine solder particles (14) is fed from a solder spray (12) to the gas tank (11), and the fine solder particles (14) are dropped from a blowing pipe (16) onto the board (20) in the inert gas (13). The fine solder particles (14) fall naturally by gravity and reach the board (20). The fine solder particles (14) having reached a pad electrode of the board (20) stay there by gravity and spread over the surface of the pad electrode upon the elapse of solder wetting time to form a solder film.
L'invention a pour objet la formation d'électrodes pour plage de connexion selon un fin intervalle, et l'obtention de perles ayant une quantité suffisante de brasage et moins de variation. A ces fins, on positionne une carte (20), tout d'abord, dans du gaz inerte (13) à l'intérieur d'un réservoir de gaz (11) avec sa surface (21) dirigée vers le haut. Ensuite, le gaz inerte (13) contenant de fines particules de brasage (14) est injecté depuis un pulvérisateur de brasage (12) dans le réservoir de gaz (11), et les fines particules de brasage (14) tombent d'un tube de soufflage (16) sur la carte (20) dans le gaz inerte (13). Les fines particules de brasage (14) tombent naturellement par gravité et atteignent la carte (20). Les fines particules de brasage (14) ayant atteint une électrode pour plage de connexion de la carte (20) restent à cet endroit par gravité et s'étalent sur la surface de l'électrode pour plage de connexion au terme du temps alloué pour l'humectage du brasage, pour constituer un film de brasage. |
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| AbstractList | [PROBLEMS] To form pad electrodes at a fine interval, and to obtain bumps having sufficient quantity of solder and having less variation. [MEANS FOR SOLVING PROBLEMS] A board (20) is positioned, at first, in inert gas (13) within a gas tank (11) with its surface (21) facing upward. Then, the inert gas (13) containing fine solder particles (14) is fed from a solder spray (12) to the gas tank (11), and the fine solder particles (14) are dropped from a blowing pipe (16) onto the board (20) in the inert gas (13). The fine solder particles (14) fall naturally by gravity and reach the board (20). The fine solder particles (14) having reached a pad electrode of the board (20) stay there by gravity and spread over the surface of the pad electrode upon the elapse of solder wetting time to form a solder film.
L'invention a pour objet la formation d'électrodes pour plage de connexion selon un fin intervalle, et l'obtention de perles ayant une quantité suffisante de brasage et moins de variation. A ces fins, on positionne une carte (20), tout d'abord, dans du gaz inerte (13) à l'intérieur d'un réservoir de gaz (11) avec sa surface (21) dirigée vers le haut. Ensuite, le gaz inerte (13) contenant de fines particules de brasage (14) est injecté depuis un pulvérisateur de brasage (12) dans le réservoir de gaz (11), et les fines particules de brasage (14) tombent d'un tube de soufflage (16) sur la carte (20) dans le gaz inerte (13). Les fines particules de brasage (14) tombent naturellement par gravité et atteignent la carte (20). Les fines particules de brasage (14) ayant atteint une électrode pour plage de connexion de la carte (20) restent à cet endroit par gravité et s'étalent sur la surface de l'électrode pour plage de connexion au terme du temps alloué pour l'humectage du brasage, pour constituer un film de brasage. |
| Author | SHIRAI, MASARU SAKAMOTO, ISAO ONOZAKI, JUNICHI |
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| DocumentTitleAlternate | PROCÉDÉ ET DISPOSITIF DE FORMATION DE PERLE DE BRASAGE |
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| RelatedCompanies | SHIRAI, MASARU SAKAMOTO, ISAO TAMURA CORPORATION ONOZAKI, JUNICHI |
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| Snippet | [PROBLEMS] To form pad electrodes at a fine interval, and to obtain bumps having sufficient quantity of solder and having less variation. [MEANS FOR SOLVING... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | METHOD AND DEVICE FOR FORMING SOLDER BUMP |
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