APPARATUS FOR PLANARIZING A PROBE CARD AND METHOD USING SAME
An apparatus (69) for use with a wafer prober (15) and a probe card (34) comprising a stiffening member (60) having a feature (68) defining a first plane. The stiffening member is mountable atop the central portion (56) of the probe card. A reference member (42) is provided to mount to the wafer pro...
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Main Authors | , |
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Format | Patent |
Language | English French |
Published |
10.02.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Abstract | An apparatus (69) for use with a wafer prober (15) and a probe card (34) comprising a stiffening member (60) having a feature (68) defining a first plane. The stiffening member is mountable atop the central portion (56) of the probe card. A reference member (42) is provided to mount to the wafer prober and has an underside with a feature (44) defining a second plane. When the feature of the stiffening member defining the first plane is urged against the feature of the reference member defining a second plane the probe elements (59) of the probe card are substantially planarized relative to the wafer prober.
La présente invention concerne un appareil (69) destiné à être utilisé avec une machine de test sous pointes (15) et une carte sonde (34) comprenant un élément raidisseur (60) comportant une caractéristique (68) définissant un premier plan. L'élément raidisseur peut être installé au-dessus d'une partie centrale (56) de la carte sonde. Un élément de référence (42) est prévu pour installer la machine de test sous pointes et comporte une face inférieure comportant une caractéristique (44) définissant un deuxième plan. Lorsque la caractéristique de l'élément raidisseur définissant le premier plan est poussée contre la caractéristique de l'élément de référence définissant un deuxième plan, les éléments (59) de sonde de la carte sonde sont sensiblement planarisés par rapport à la machine de test sous pointes. |
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AbstractList | An apparatus (69) for use with a wafer prober (15) and a probe card (34) comprising a stiffening member (60) having a feature (68) defining a first plane. The stiffening member is mountable atop the central portion (56) of the probe card. A reference member (42) is provided to mount to the wafer prober and has an underside with a feature (44) defining a second plane. When the feature of the stiffening member defining the first plane is urged against the feature of the reference member defining a second plane the probe elements (59) of the probe card are substantially planarized relative to the wafer prober.
La présente invention concerne un appareil (69) destiné à être utilisé avec une machine de test sous pointes (15) et une carte sonde (34) comprenant un élément raidisseur (60) comportant une caractéristique (68) définissant un premier plan. L'élément raidisseur peut être installé au-dessus d'une partie centrale (56) de la carte sonde. Un élément de référence (42) est prévu pour installer la machine de test sous pointes et comporte une face inférieure comportant une caractéristique (44) définissant un deuxième plan. Lorsque la caractéristique de l'élément raidisseur définissant le premier plan est poussée contre la caractéristique de l'élément de référence définissant un deuxième plan, les éléments (59) de sonde de la carte sonde sont sensiblement planarisés par rapport à la machine de test sous pointes. |
Author | FOSTER, CRAIG, Z WAKEFIELD, RAY |
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DocumentTitleAlternate | APPAREIL DE PLANARISATION D'UNE CARTE SONDE ET PROCEDE CORRESPONDANT |
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RelatedCompanies | NEXTEST SYSTEMS CORPORATION FOSTER, CRAIG, Z WAKEFIELD, RAY |
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Snippet | An apparatus (69) for use with a wafer prober (15) and a probe card (34) comprising a stiffening member (60) having a feature (68) defining a first plane. The... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING |
Title | APPARATUS FOR PLANARIZING A PROBE CARD AND METHOD USING SAME |
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