SACRIFICIAL METAL LINER FOR COPPER INTERCONNECTS

A semiconductor device which includes an improved liner structure formed in a via (5) having extended sidewall portions and a bottom (8) penetrating a metal liner (7). The liner structure includes two liner layers, the first (6) being on the via sidewalls, but not the bottom, and the second being (9...

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Bibliographic Details
Main Authors SIMON, ANDREW, H, COONEY, EDWARD, C., III, STAMPER, ANTHONY, K, MARINO, JEFFREY, R, GEFFKEN, ROBERT, M
Format Patent
LanguageEnglish
French
Published 19.08.2004
Edition7
Subjects
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