METHOD FOR FORMING A SEMICONDUCTOR DEVICE AND STRUCTURE THEREOF
Dummy features (64, 65, 48a, 48b) are formed within an interlevel dielectric layer (36). In one embodiment, a non-gap filling dielectric layer (72) is formed over the dummy features (64, 65, 48a, 48b) to form voids (74) between the dummy features (64, 65, 48a, 48b) or a dummy feature (48a) and a cur...
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Main Authors | , , , , , , , , |
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Format | Patent |
Language | English French |
Published |
22.07.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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