METHOD FOR FORMING A SEMICONDUCTOR DEVICE AND STRUCTURE THEREOF

Dummy features (64, 65, 48a, 48b) are formed within an interlevel dielectric layer (36). In one embodiment, a non-gap filling dielectric layer (72) is formed over the dummy features (64, 65, 48a, 48b) to form voids (74) between the dummy features (64, 65, 48a, 48b) or a dummy feature (48a) and a cur...

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Bibliographic Details
Main Authors LII, YEONG-JYH, T, SMITH, BRADLEY, P, YU, KATHLEEN, C, SOLOMENTSEV, YURI, E, SPARKS, TERRY, G, STROZEWSKI, KIRK, J, GOLDBERG, CINDY, K, FILIPIAK, STANLEY, M, FLAKE, JOHN, C
Format Patent
LanguageEnglish
French
Published 22.07.2004
Edition7
Subjects
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