METHOD FOR FORMING AN OXIDE FILM WITH NON-UNIFORM THICKNESS AT A SILICON SUBSTRATE SURFACE

The invention concerns a method comprising steps which consist in: a) implanting in predetermined zones of the substrate an efficient dose of atoms of a species accelerating the substrate oxidation kinetics; and b) growing by oxidation a silicon oxide film with non-uniform thickness on the substrate...

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Bibliographic Details
Main Authors HALIMAOUI, AOMAR, GROUILLET, ANDRE
Format Patent
LanguageEnglish
French
Published 10.02.2000
Edition7
Subjects
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Summary:The invention concerns a method comprising steps which consist in: a) implanting in predetermined zones of the substrate an efficient dose of atoms of a species accelerating the substrate oxidation kinetics; and b) growing by oxidation a silicon oxide film with non-uniform thickness on the substrate surface. The invention is useful for producing oxide films for MOS transistor grids. Le procédé comprend: a) l'implantation dans des zones prédéterminées du substrat d'une dose effective d'atomes d'une espèce chimique accélérant la cinétique d'oxydation du substrat; et b) la croissance par oxydation d'une couche d'oxyde de silicium d'épaisseur non-uniforme sur la surface du substrat. Application à la fabrication des couches d'oxyde de grille de transistors MOS.
Bibliography:Application Number: WO1999FR01756