Flap in an adhesive tape for semiconductor manufacturing

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Main Authors Mashino Michio, Katou Rie, Taniguchi Kouhei, Matsuzaki Takayuki, Katou Shinya, Komorida Kouji, Sakuta Tatsuya
Format Patent
LanguageEnglish
Published 05.12.2017
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Author Taniguchi Kouhei
Komorida Kouji
Matsuzaki Takayuki
Katou Rie
Katou Shinya
Mashino Michio
Sakuta Tatsuya
Author_xml – fullname: Mashino Michio
– fullname: Katou Rie
– fullname: Taniguchi Kouhei
– fullname: Matsuzaki Takayuki
– fullname: Katou Shinya
– fullname: Komorida Kouji
– fullname: Sakuta Tatsuya
BookMark eNrjYmDJy89L5WSwcMtJLFDIzFNIBKKUjNTizLJUhZLEglSFtPwiheLU3Mzk_LyU0uQSIC83Ma80LTG5pLQoMy-dh4E1LTGnOJUXSnMzKLi5hjh76KYW5MenFhckJqfmpZbEhwa7WBiYmBibBgcbE6EEALCWMGE
ContentType Patent
DBID EVB
DatabaseName esp@cenet
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID USD804435SS
GroupedDBID EVB
ID FETCH-epo_espacenet_USD804435SS3
IEDL.DBID EVB
IngestDate Fri Jul 19 12:40:22 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_USD804435SS3
Notes Application Number: US201429491391F
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171205&DB=EPODOC&CC=US&NR=D804435S
ParticipantIDs epo_espacenet_USD804435SS
PublicationCentury 2000
PublicationDate 20171205
PublicationDateYYYYMMDD 2017-12-05
PublicationDate_xml – month: 12
  year: 2017
  text: 20171205
  day: 05
PublicationDecade 2010
PublicationYear 2017
RelatedCompanies HITACHI CHEMICAL COMPANY, LTD
RelatedCompanies_xml – name: HITACHI CHEMICAL COMPANY, LTD
Score 3.1253266
SourceID epo
SourceType Open Access Repository
Title Flap in an adhesive tape for semiconductor manufacturing
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171205&DB=EPODOC&locale=&CC=US&NR=D804435S
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_mFPVNp-L8Ig_St-JqU9c-FGHtyhD2gV1lbyNpUzaYabEd_vteQqe-KOQhH3BcDi53l9zvAnDPhG3znGGkmmbCpJSnpucJz8RwiHG0J7abK4DzePI0SujLwlm0YLXDwug6oZ-6OCJqVIr6Xuvzuvy5xAp1bmX1wNc4VTxHcz80mujY6luPPccIB_5wNg2ngREEfhIbk1c_dHsUPYN4D_aVE62q7A_fBgqTUv42KNEJHMyQlqxPoSVkB46C3b9rHTgcN8_d2G00rzoDN9qwkqwlYdiylVBZ56RmpSDodZJKpbgXUtVuxdE7k1sFWNAIxHMg0XAejExkYfm922US73iN7Qtoy0KKSyDIc8qE62Y2RYFafU65h9aaZp6TWzm1u9D9k8zVP2vXcKzEphM0nBto1x9bcYtmtuZ3WkJfG7SDjw
link.rule.ids 230,309,786,891,25594,76903
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_mFOebTmXzMw_St-JqU9s-FGHtytR9YTfZ20jalA00K67Df99L2NQXhTzkA0JycLn7Jfe7ANwwYds8Z4hU00yYlPLU9H3hmwiHGEd7Ynu5Ijj3B_fdCX2aOtMKzLdcGJ0n9FMnR0SNSlHfS31eFz-XWJGOrVzd8gV2LR_icRAZG3RsudZdyzGidtAZDaNhaIRhMEmMwUsQeS2KnkGyA7suAkINlF7bipNS_DYo8SHsjXAuWR5BRcg61MLtv2t12O9vnruxutG81TF48RsryEIShiWbCxV1TkpWCIJeJ1mpEPelVLlbsfXO5FoRFjQD8QRI3BmHXROXMPve7WySbNea2KdQlUspGkDQ8U-Z8LzMpihQy-WU-2itaeY7uZVTuwnNP6c5-2fsGmrdcb836z0Ons_hQIlQB2s4F1AtP9biEk1uya-0tL4AZ4aGeQ
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Flap+in+an+adhesive+tape+for+semiconductor+manufacturing&rft.inventor=Mashino+Michio&rft.inventor=Katou+Rie&rft.inventor=Taniguchi+Kouhei&rft.inventor=Matsuzaki+Takayuki&rft.inventor=Katou+Shinya&rft.inventor=Komorida+Kouji&rft.inventor=Sakuta+Tatsuya&rft.date=2017-12-05&rft.externalDBID=S&rft.externalDocID=USD804435SS