Bonding structure and method
A bonding structure and a method for bonding components, wherein the bonding structure includes a nanoparticle preform. In accordance with embodiments, the nanoparticle preform is placed on a substrate and a workpiece is placed on the nanoparticle preform.
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
12.06.2018
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A bonding structure and a method for bonding components, wherein the bonding structure includes a nanoparticle preform. In accordance with embodiments, the nanoparticle preform is placed on a substrate and a workpiece is placed on the nanoparticle preform. |
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| AbstractList | A bonding structure and a method for bonding components, wherein the bonding structure includes a nanoparticle preform. In accordance with embodiments, the nanoparticle preform is placed on a substrate and a workpiece is placed on the nanoparticle preform. |
| Author | Won, Yun Sung Krishnan, Shutesh |
| Author_xml | – fullname: Won, Yun Sung – fullname: Krishnan, Shutesh |
| BookMark | eNrjYmDJy89L5WSQccrPS8nMS1coLikqTS4pLUpVSMxLUchNLcnIT-FhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGhwZaWluYmFqZORsZEKAEAO4clfw |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| ExternalDocumentID | US9997485B2 |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_US9997485B23 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 14:35:22 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_US9997485B23 |
| Notes | Application Number: US201715663802 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180612&DB=EPODOC&CC=US&NR=9997485B2 |
| ParticipantIDs | epo_espacenet_US9997485B2 |
| PublicationCentury | 2000 |
| PublicationDate | 20180612 |
| PublicationDateYYYYMMDD | 2018-06-12 |
| PublicationDate_xml | – month: 06 year: 2018 text: 20180612 day: 12 |
| PublicationDecade | 2010 |
| PublicationYear | 2018 |
| RelatedCompanies | Semiconductor Components Industries, LLC |
| RelatedCompanies_xml | – name: Semiconductor Components Industries, LLC |
| Score | 3.1563597 |
| Snippet | A bonding structure and a method for bonding components, wherein the bonding structure includes a nanoparticle preform. In accordance with embodiments, the... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Bonding structure and method |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180612&DB=EPODOC&locale=&CC=US&NR=9997485B2 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQMTE2N082SDPTNU0yNgN1UEx0E1NTQcv-LE2MzFMNkwxSQRuFff3MPEJNvCJMI5gYMmF7YcDnhJaDD0cE5qhkYH4vAZfXBYhBLBfw2spi_aRMoFC-vVuIrYsatHdsaAGqsdVcnGxdA_xd_J3VnJ1tQ4PV_IJsge0gcxMLUydgac0KakWDjtl3DXMCbUopQK5R3AQZ2AKAhuWVCDEwpeYJM3A6wy5eE2bg8IXOdwOZ0KxXLMIgA7oAGFjPKEBOfC0tSlVIzEtRgNwALcqg4OYa4uyhC7QmHu6l-NBguIOMxRhYgD39VAkGhRRzQ8MkU8NES-OUFGBHItXCzMDYIjkJ2EMxSEpMtjCWZJDEaYwUHjlpBi5Q2OiCr9yRYWABujNVFliXliTJgUMBACqgd-U |
| link.rule.ids | 230,309,786,891,25594,76906 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT4MwEL8s0zjfdGqcTuXB8EYEC5Q9EBNgBHWwxYHZG6FQk73g4jD--147Nn3Rt6ZNrtdL7uPX9u4Abk1Caam_2ZrFiC0AiqkVnItvfyPznnKD6VwkCseJHWXm08JadGC5zYWRdUK_ZHFE1KgS9b2R9nr1c4kVyL-V6zu2xKn3hzB1A7VFx4YjPLYaeO54Ng2mvur7bjZXkxcX4yBqOpaH1nqPiuK8InJ69URSyuq3RwmPYH-GxOrmGDq87kPP3zZe68NB3L5347BVvfUJDEUDYPQzyqbi6-cHV4q6UjYdoE9BCcepH2m4Tb47Up7NdwyRM-gi0ufnoFTUMJhlFCNSVQgkuGPrxCkZIhSdFaVDBjD4k8zFP2s30IvSeJJPHpPnSzgUctJk-50hdJFnfoV-tWHXUiLf7Z560g |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Bonding+structure+and+method&rft.inventor=Won%2C+Yun+Sung&rft.inventor=Krishnan%2C+Shutesh&rft.date=2018-06-12&rft.externalDBID=B2&rft.externalDocID=US9997485B2 |