Semiconductor device isolation via depleted coupling layer

A device includes a semiconductor substrate, a doped isolation barrier disposed in the semiconductor substrate and having a first conductivity type, a body region disposed in the semiconductor substrate within the doped isolation barrier, having the first conductivity type, and in which a channel is...

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Bibliographic Details
Main Authors Zhu Ronghua, Zuo Jiang-Kai, Yang Hongning, Lin Xin
Format Patent
LanguageEnglish
Published 10.04.2018
Subjects
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