Molded cavity package with embedded conductive layer and enhanced sealing
A base plate with a first side having an elevated portion, a recessed portion laterally surrounding the elevated portion, and a vertical face extending from the recessed portion to the elevated portion is provided. At least a part of the vertical face is covered with a metal layer. A mold compound s...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
16.01.2018
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Subjects | |
Online Access | Get full text |
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