Packaging solutions for devices and systems comprising lateral GaN power transistors

• Main Authors: McKnight-MacNeil Cameron, Mizan Ahmad, Coates Stephen, Klowak Greg P
• Format: Patent
• Language: English
• Published: 21.11.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Packaging solutions for devices and systems comprising lateral GaN power transistors are disclosed, including components of a packaging assembly, a semiconductor device structure, and a method of fabrication thereof. In the packaging assembly, a GaN die, comprising one or more lateral GaN power tran...