Semiconductor storage device

According to one embodiment, a semiconductor storage device includes a first substrate, a casing, a first non-volatile memory, a controller, and a first member. The first member connects thermally the first substrate and the casing. At least a portion of the first member is positioned between the fi...

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Main Authors Sakai Yoshimichi, Kimura Fumiaki
Format Patent
LanguageEnglish
Published 21.11.2017
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Abstract According to one embodiment, a semiconductor storage device includes a first substrate, a casing, a first non-volatile memory, a controller, and a first member. The first member connects thermally the first substrate and the casing. At least a portion of the first member is positioned between the first non-volatile memory and the controller.
AbstractList According to one embodiment, a semiconductor storage device includes a first substrate, a casing, a first non-volatile memory, a controller, and a first member. The first member connects thermally the first substrate and the casing. At least a portion of the first member is positioned between the first non-volatile memory and the controller.
Author Kimura Fumiaki
Sakai Yoshimichi
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RelatedCompanies Toshiba Memory Corporation
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Snippet According to one embodiment, a semiconductor storage device includes a first substrate, a casing, a first non-volatile memory, a controller, and a first...
SourceID epo
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SubjectTerms CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
STATIC STORES
Title Semiconductor storage device
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