Wire bond wires for interference shielding

• Main Authors: Sun Zhuowen, Prabhu Ashok S, Awujoola Abiola, Zohni Wael, Subido Willmar
• Format: Patent
• Language: English
• Published: 07.11.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface and has a ground plane. A first microelectronic device is coupled to the upper surfa...