Wire bond wires for interference shielding
Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface and has a ground plane. A first microelectronic device is coupled to the upper surfa...
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Format | Patent |
Language | English |
Published |
07.11.2017
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Abstract | Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface and has a ground plane. A first microelectronic device is coupled to the upper surface of the substrate. Wire bond wires are coupled to the ground plane for conducting the interference thereto and extending away from the upper surface of the substrate. A first portion of the wire bond wires is positioned to provide a shielding region for the first microelectronic device with respect to the interference. A second portion of the wire bond wires is not positioned to provide the shielding region. A second microelectronic device is coupled to the substrate and located outside of the shielding region. A conductive surface is over the first portion of the wire bond wires for covering the shielding region. |
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AbstractList | Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface and has a ground plane. A first microelectronic device is coupled to the upper surface of the substrate. Wire bond wires are coupled to the ground plane for conducting the interference thereto and extending away from the upper surface of the substrate. A first portion of the wire bond wires is positioned to provide a shielding region for the first microelectronic device with respect to the interference. A second portion of the wire bond wires is not positioned to provide the shielding region. A second microelectronic device is coupled to the substrate and located outside of the shielding region. A conductive surface is over the first portion of the wire bond wires for covering the shielding region. |
Author | Prabhu Ashok S Sun Zhuowen Awujoola Abiola Subido Willmar Zohni Wael |
Author_xml | – fullname: Sun Zhuowen – fullname: Prabhu Ashok S – fullname: Awujoola Abiola – fullname: Zohni Wael – fullname: Subido Willmar |
BookMark | eNrjYmDJy89L5WTQCs8sSlVIys9LUSgHsooV0vKLFDLzSlKL0lKLUvOSUxWKMzJTc1Iy89J5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakl8aLClhaGRiYGRk5ExEUoAzToqkQ |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
ExternalDocumentID | US9812402B2 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US9812402B23 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 13:07:21 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US9812402B23 |
Notes | Application Number: US201615344990 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171107&DB=EPODOC&CC=US&NR=9812402B2 |
ParticipantIDs | epo_espacenet_US9812402B2 |
PublicationCentury | 2000 |
PublicationDate | 20171107 |
PublicationDateYYYYMMDD | 2017-11-07 |
PublicationDate_xml | – month: 11 year: 2017 text: 20171107 day: 07 |
PublicationDecade | 2010 |
PublicationYear | 2017 |
RelatedCompanies | Invensas Corporation |
RelatedCompanies_xml | – name: Invensas Corporation |
Score | 3.1215217 |
Snippet | Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Wire bond wires for interference shielding |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171107&DB=EPODOC&locale=&CC=US&NR=9812402B2 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5KFfWmVbG-2IPkIATbPBpzCEJeFKEPbCO9lewj2Etamoh_35klrV70Fjawj4HZb2Z3vm8BHgpL5pawuOm7TmE6Mu-bfp4Xpicx1lY9riQncvJoPBhmzuvCXbRgtePCaJ3QLy2OiB4l0N9rvV9vfg6xYl1bWT3xFTatX9J5EBtNdtz3KJ0x4jBIppN4EhlRFGQzY_wW-ARkPSvE3fqAomiS2U_eQyKlbH4jSnoKh1PsrKzPoKXKDhxHu4fXOnA0au678bNxveocHqlOlfF1KRnJC1cMo01GYg_bhrHHqg-qRkMougCWJvNoaOKgy_0Cl9lsPz37EtqY96srYMJz0H58IHMhHFfZ_nNhKdsSpCGPIKu60P2zm-t__t3ACVlKE-q8W2jX2091h8ha83ttk284hX54 |
link.rule.ids | 230,309,786,891,25594,76904 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5KFetNq2J97kFyEIJtHo05BCEvojZpsYn0FrKbDfaSlibi33c2pNWL3pZd2MfA7LezO9-3AHeFkmcKU6hs6loha3k2ks0sK2Qjx7M2H1KeU0FODqNxkGgvC33RgeWWC9PohH414ojoUQz9vW726_XPJZbb5FZWD3SJVasnP7ZcqY2OR4YIZyTXtrzZ1J06kuNYyVyK3ixTANlQsXG33jMwIhQy-967LUgp69-I4h_B_gw7K-tj6PCyDz1n-_FaHw7C9r0bi63rVSdwL_JUCV2VORHywhXB0yYRYg-blrFHqg-RjYZQdArE92InkHHQdLfANJnvpqeeQRfjfn4OhBka2o-O84wxTeeq-VgoXFWY0JBHkOUDGPzZzcU_bbfQC-Jwkk6eo9dLOBRWa8h1xhV0680nv0aUrelNY59vSF6BYw |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Wire+bond+wires+for+interference+shielding&rft.inventor=Sun+Zhuowen&rft.inventor=Prabhu+Ashok+S&rft.inventor=Awujoola+Abiola&rft.inventor=Zohni+Wael&rft.inventor=Subido+Willmar&rft.date=2017-11-07&rft.externalDBID=B2&rft.externalDocID=US9812402B2 |