Folded fin heat transfer device

• Main Authors: Tracy Mark S, Moore Earl W
• Format: Patent
• Language: English
• Published: 05.09.2017
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MECHANICAL ENGINEERING; PHYSICS; SEMICONDUCTOR DEVICES; WEAPONS

A system for cooling a heat producing device is provided. The system can include an air mover (110) wherein at least a portion of the discharge airflow (115) is directed radially outward. The system can also include a thermal conduit (120) and a thermal member (130). The thermal member can have a first surface (135), a second surface (140) and at least one integrally formed heat exchange surface (150). At least a portion of the heat exchange surface (150) can be at least partially disposed in the air mover discharge airflow (115). At least a portion of the first surface (135) can be disposed proximate the thermal conduit (120). At least a portion of the second surface (140) can be disposed proximate the air mover (110).