Dicing sheet with protective film forming layer and method for producing chip

• Main Authors: Saeki Naoya, Shinoda Tomonori, Takano Ken
• Format: Patent
• Language: English
• Published: 05.09.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

[Problem] To provide a dicing sheet that is with a protective film formation layer, can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, is such that the peeling of the protective film and the dicing sheet can be easily performed, a...