Microfused silicon strain gauge (MSG) pressure sensor package
Methods and apparatus for a microfused silicon strain gauge pressure sensor. A pressure sensor package includes a sense element configured to be exposed to a pressure environment, the sense element including at least one strain gauge, an electronics package disposed on a carrier and electrically cou...
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Format | Patent |
Language | English |
Published |
29.08.2017
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Subjects | |
Online Access | Get full text |
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Abstract | Methods and apparatus for a microfused silicon strain gauge pressure sensor. A pressure sensor package includes a sense element configured to be exposed to a pressure environment, the sense element including at least one strain gauge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that includes the sense element, the port enabling a decoupling feature for sealing and parasitic sealing forces and a reduction of a port length, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface. |
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AbstractList | Methods and apparatus for a microfused silicon strain gauge pressure sensor. A pressure sensor package includes a sense element configured to be exposed to a pressure environment, the sense element including at least one strain gauge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that includes the sense element, the port enabling a decoupling feature for sealing and parasitic sealing forces and a reduction of a port length, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface. |
Author | Wiersma Dedde Hedzer Jacobs Frank Hendri Schoot Uiterkamp Ernie Johannus Antonius |
Author_xml | – fullname: Jacobs Frank Hendri – fullname: Wiersma Dedde Hedzer – fullname: Schoot Uiterkamp Ernie Johannus Antonius |
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Notes | Application Number: US201514632124 |
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RelatedCompanies | Sensata Technologies, Inc |
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Snippet | Methods and apparatus for a microfused silicon strain gauge pressure sensor. A pressure sensor package includes a sense element configured to be exposed to a... |
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SubjectTerms | MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS TESTING |
Title | Microfused silicon strain gauge (MSG) pressure sensor package |
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