Semiconductor device including a solder barrier
A semiconductor device includes a leadframe and a semiconductor chip including a contact. The contact faces the leadframe and is electrically coupled to the leadframe via solder. The semiconductor device includes a solder barrier adjacent to the first contact and an edge of the chip.
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| Main Authors | , , |
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| Format | Patent |
| Language | English |
| Published |
02.05.2017
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A semiconductor device includes a leadframe and a semiconductor chip including a contact. The contact faces the leadframe and is electrically coupled to the leadframe via solder. The semiconductor device includes a solder barrier adjacent to the first contact and an edge of the chip. |
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| AbstractList | A semiconductor device includes a leadframe and a semiconductor chip including a contact. The contact faces the leadframe and is electrically coupled to the leadframe via solder. The semiconductor device includes a solder barrier adjacent to the first contact and an edge of the chip. |
| Author | Tay Wee Boon Calo Paul Armand Woo Kuan Ching |
| Author_xml | – fullname: Calo Paul Armand – fullname: Woo Kuan Ching – fullname: Tay Wee Boon |
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| Notes | Application Number: US201614987139 |
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| PublicationDateYYYYMMDD | 2017-05-02 |
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| PublicationYear | 2017 |
| RelatedCompanies | Infineon Technologies AG |
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| Snippet | A semiconductor device includes a leadframe and a semiconductor chip including a contact. The contact faces the leadframe and is electrically coupled to the... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Semiconductor device including a solder barrier |
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