Apparatus and operation method thereof

• Main Authors: Liao Si-Wen, Xu Jia-Wei, Lo Fu-Shun, Wu Chien-Cheng, Lin Mao-Cheng, Liu Ding-I, Wang Lan-Hai
• Format: Patent
• Language: English
• Published: 28.03.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An apparatus includes a body and a surface for receiving a semiconductor wafer carrier is provided. A nozzle and a venting hole are provided on the surface. The semiconductor wafer carrier has at least one selectively closable capped opening at a bottom, top and/or side surface thereof. The capped o...