MEMS structures and methods for forming the same
A method includes forming a MEMS device, forming a bond layer adjacent the MEMS device, and forming a protection layer over the bond layer. The steps of forming the bond layer and the protection layer include in-situ deposition of the bond layer and the protection layer.
Saved in:
| Main Authors | , , , , , , , |
|---|---|
| Format | Patent |
| Language | English |
| Published |
03.01.2017
|
| Subjects | |
| Online Access | Get full text |
Cover
Loading…
| Abstract | A method includes forming a MEMS device, forming a bond layer adjacent the MEMS device, and forming a protection layer over the bond layer. The steps of forming the bond layer and the protection layer include in-situ deposition of the bond layer and the protection layer. |
|---|---|
| AbstractList | A method includes forming a MEMS device, forming a bond layer adjacent the MEMS device, and forming a protection layer over the bond layer. The steps of forming the bond layer and the protection layer include in-situ deposition of the bond layer and the protection layer. |
| Author | Liu Ping-Yin Huang Xin-Hua Tsai Chia-Shiung Huang Hsin-Ting Cheng Chun-Wen Hsieh Yuan-Chih Peng Jung-Huei Chao Lan-Lin |
| Author_xml | – fullname: Liu Ping-Yin – fullname: Chao Lan-Lin – fullname: Huang Hsin-Ting – fullname: Tsai Chia-Shiung – fullname: Hsieh Yuan-Chih – fullname: Cheng Chun-Wen – fullname: Huang Xin-Hua – fullname: Peng Jung-Huei |
| BookMark | eNrjYmDJy89L5WQw8HX1DVYoLikqTS4pLUotVkjMS1HITS3JyE8pVkjLLwLh3My8dIWSjFSF4sTcVB4G1rTEnOJUXijNzaDg5hri7KGbWpAfn1pckJicmpdaEh8abGlqbGxhbuZkZEyEEgDTxyx2 |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| ExternalDocumentID | US9533876B2 |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_US9533876B23 |
| IEDL.DBID | EVB |
| IngestDate | Fri Aug 30 05:42:32 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_US9533876B23 |
| Notes | Application Number: US201514731823 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170103&DB=EPODOC&CC=US&NR=9533876B2 |
| ParticipantIDs | epo_espacenet_US9533876B2 |
| PublicationCentury | 2000 |
| PublicationDate | 20170103 |
| PublicationDateYYYYMMDD | 2017-01-03 |
| PublicationDate_xml | – month: 01 year: 2017 text: 20170103 day: 03 |
| PublicationDecade | 2010 |
| PublicationYear | 2017 |
| RelatedCompanies | Taiwan Semiconductor Manufacturing Company, Ltd |
| RelatedCompanies_xml | – name: Taiwan Semiconductor Manufacturing Company, Ltd |
| Score | 3.0749407 |
| Snippet | A method includes forming a MEMS device, forming a bond layer adjacent the MEMS device, and forming a protection layer over the bond layer. The steps of... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING |
| Title | MEMS structures and methods for forming the same |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170103&DB=EPODOC&locale=&CC=US&NR=9533876B2 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3NS8MwFH-MKepNp-L8IgfprditqSSHIjRtGUK3YVfZbSQ1gx1WB6347_uSddOLHgIhgXzBe-_3kpffA3igXHGFro9LgyV1Ef8zl6khc8uhROsgEWNYEtds_DQq6Ms8mHdgtfsLY3lCvyw5IkpUifLeWH29-bnEim1sZf2oVtj08ZzOwthpvWNDLu75ThyFyXQST4QjRFjkzvg1NFGUKPgRausDg6INzX7yFplPKZvfFiU9hcMpDlY1Z9DRVQ-OxS7xWg-Osva9G6ut6NXn4GVJlpMt3esn-shEVu9km_-5Jog8TVmjHSKI6Egt1_oCSJrMxMjFqRf7bS6KfL9I_xK66P3rKyAlM4Q1gzLQA059hXDG88ol14wbYhZJ-9D_c5jrf_pu4MScl71N8G-hi8vXd2hfG3VvT-YbsEd9rA |
| link.rule.ids | 230,309,786,891,25594,76903 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3NS8MwFH-MKc6bTsX5mYP0VuzWVNtDEfpF1bUbtpXdStNlsMPqoBX_fV-ybnrRQyAkkC94eb9f8vILwB21mMWQ-qjUWFAV8b-pmmxkquWoQO9QIMaQIq5R_BBm9GVmzDqw3L6FkTqhX1IcES2qRHtv5H69_jnE8mRsZX3Pllj08RSktqe07FiIi2u64jm2P514E1dxXTtLlPjNFlGUaPgO7tZ7j8gIJVN6d8SjlPVvjxIcwf4UG6uaY-jwqg89d_vxWh8Oova-G7Ot6dUnoEV-lJCN3OsncmRSVHOy-f-5Jog8RVqhHyKI6EhdrPgpkMBP3VDFrvPdNPMs2Q1SP4Musn9-DqQ0hWDNsDT40KI6QzijaeXC4qYlhFkKOoDBn81c_FN3C70wjcb5-Dl-vYRDsXbyZEG_gi5OhV-jr23YjVylb7WlgJY |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=MEMS+structures+and+methods+for+forming+the+same&rft.inventor=Liu+Ping-Yin&rft.inventor=Chao+Lan-Lin&rft.inventor=Huang+Hsin-Ting&rft.inventor=Tsai+Chia-Shiung&rft.inventor=Hsieh+Yuan-Chih&rft.inventor=Cheng+Chun-Wen&rft.inventor=Huang+Xin-Hua&rft.inventor=Peng+Jung-Huei&rft.date=2017-01-03&rft.externalDBID=B2&rft.externalDocID=US9533876B2 |