Semiconductor package with a bridge interposer
There are disclosed herein various implementations of semiconductor packages including a bridge interposer. One exemplary implementation includes a first active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The semicondu...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
30.08.2016
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Subjects | |
Online Access | Get full text |
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