Semiconductor package with a bridge interposer

• Main Authors: Zhao Sam Ziqun, Vorenkamp Pieter, Hu Kevin Kunzhong, Khan Rezaur Rahman, Chen Xiangdong, Karikalan Sampath K
• Format: Patent
• Language: English
• Published: 30.08.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

There are disclosed herein various implementations of semiconductor packages including a bridge interposer. One exemplary implementation includes a first active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The semicondu...