Selective removal of charge-trapping layer for select gate transistors and dummy memory cells in 3D stacked memory
Fabrication techniques for a three-dimensional stack memory device remove the charge-trapping material from the select gate transistors and the dummy memory cells to avoid unintentional programming which increases the threshold voltage. In one approach, a stack is formed with a different sacrificial...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
02.08.2016
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Subjects | |
Online Access | Get full text |
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