Conformal film deposition for gapfill
A method and apparatus for conformally depositing a dielectric oxide in high aspect ratio gaps in a substrate is disclosed. A substrate is provided with one or more gaps into a reaction chamber where each gap has a depth to width aspect ratio of greater than about 5:1. A first dielectric oxide layer...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
31.05.2016
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Subjects | |
Online Access | Get full text |
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