Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate

A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirror...

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Main Authors ZENG ANDREW AN, WANG CHUNHAI, ZHANG YI, GOODMAN FREDERICK ARNOLD, HUANG CHUNSHENG, TANG SHOUHONG
Format Patent
LanguageEnglish
Published 08.03.2016
Subjects
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
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Abstract A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.
AbstractList A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.
Author TANG SHOUHONG
GOODMAN FREDERICK ARNOLD
ZHANG YI
WANG CHUNHAI
HUANG CHUNSHENG
ZENG ANDREW AN
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RelatedCompanies TANG SHOUHONG
GOODMAN FREDERICK ARNOLD
ZHANG YI
WANG CHUNHAI
KLA-TENCOR CORPORATION
HUANG CHUNSHENG
ZENG ANDREW AN
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Snippet A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and...
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SubjectTerms MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
Title Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate
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