Interconnect devices for electronic packaging assemblies

• Main Authors: GOWDA ARUN VIRUPAKSHA, GIOVANNIELLO CHRISTIAN, VOGEL JOHN ANTHONY, SHADDOCK DAVID MULFORD, REFAI-AHMED GAMAL
• Format: Patent
• Language: English
• Published: 02.02.2016
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An electronic packaging assembly having a semiconductor integrated circuit and a plurality of interconnect components is provided. The plurality of interconnect components is operatively coupled to the semiconductor integrated circuit. Further, one or more interconnect components include one or more...