Interconnect devices for electronic packaging assemblies

• Main Authors: GOWDA ARUN VIRUPAKSHA, GIOVANNIELLO CHRISTIAN, VOGEL JOHN ANTHONY, SHADDOCK DAVID MULFORD, REFAI-AHMED GAMAL
• Format: Patent
• Language: English
• Published: 02.02.2016
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An electronic packaging assembly having a semiconductor integrated circuit and a plurality of interconnect components is provided. The plurality of interconnect components is operatively coupled to the semiconductor integrated circuit. Further, one or more interconnect components include one or more support elements having a first surface and a second surface, and one or more spring elements having a first end and a second end, and wherein first ends of the one or more spring elements are coupled to the first surface or the second surface of a respective support element.