Non-hermetic sealed multi-chip module package

• Main Authors: TOY HILTON T, TUNGA KRISHNA R, BODENWEBER PAUL F, ZITZ JEFFREY A
• Format: Patent
• Language: English
• Published: 11.08.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

A multi-chip module (MCM) package is provided and includes a substrate and a hat assembly. The substrate includes a surface on which chips of the MCM are re-workable. The hat assembly is configured to be non-hermetically sealed to the substrate. The hat assembly and the substrate are configured for tension-type disassembly in a dimension oriented substantially normally with respect to a plane of the substrate surface.