Vertically integrated systems
Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electric...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
26.05.2015
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Subjects | |
Online Access | Get full text |
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