Pressure-sensitive adhesive composition, pressure-sensitive adhesive and optical film

• Main Authors: NAKANO HIROTO, FURUE NAOMI, MIYAZAKI HIDEKI, HATTORI SHINYA, MASUDA SHUHEI, SAITO MASAHITO, KAMOI AKIRA
• Format: Patent
• Language: English
• Published: 06.01.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PHYSICS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

A pressure-sensitive adhesive composition which is excellent in durability under high temperature and humidity conditions and can thus inhibit bright defect even when applied to a large-sized optical film; a pressure-sensitive adhesive; and an optical film. A pressure-sensitive adhesive composition including an acrylic copolymer (A) bearing a reactive functional group, an acrylic copolymer (B) and an isocyanate compound (C), wherein the quantity of the isocyanate compound (C) is 5 to 30 parts by weight per 100 parts by weight of a mixture of the acrylic copolymer (A) and the acrylic copolymer (B) and the elongation at break and 200% modulus as determined at 25 degrees C. by the tensile test are 300 to 1000% and 0.2 to 3 N/mm2 respectively.