Method of manufacturing printed circuit board
Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing t...
Saved in:
Main Authors | , , , , , , |
---|---|
Format | Patent |
Language | English |
Published |
11.11.2014
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!