Trace routing within a semiconductor package substrate
A semiconductor device includes a substrate configured with a plurality of conductive traces. The traces are configured to electrically couple to an integrated circuit (IC) die and at least one of the plurality of conductive traces includes first electrically conductive portions in a first electrica...
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Main Author | |
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Format | Patent |
Language | English |
Published |
28.10.2014
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Subjects | |
Online Access | Get full text |
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