Light emitting device module
Disclosed is a light emitting device module including a package body, a first lead frame and a second lead frame provided on the package body, a light emitting device electrically connected to the first lead frame and the second lead frame, a first pad and a second pad respectively formed on the low...
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Main Author | |
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Format | Patent |
Language | English |
Published |
26.08.2014
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Subjects | |
Online Access | Get full text |
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Abstract | Disclosed is a light emitting device module including a package body, a first lead frame and a second lead frame provided on the package body, a light emitting device electrically connected to the first lead frame and the second lead frame, a first pad and a second pad respectively formed on the lower surfaces of the first lead frame and the second lead frame, and a third pad formed on the lower surface of the package body, wherein at least one of the first pad, the second pad and the third pad includes a plurality of sub-pads. |
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AbstractList | Disclosed is a light emitting device module including a package body, a first lead frame and a second lead frame provided on the package body, a light emitting device electrically connected to the first lead frame and the second lead frame, a first pad and a second pad respectively formed on the lower surfaces of the first lead frame and the second lead frame, and a third pad formed on the lower surface of the package body, wherein at least one of the first pad, the second pad and the third pad includes a plurality of sub-pads. |
Author | JUN EUI GEUN |
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Notes | Application Number: US201213343141 |
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PublicationYear | 2014 |
RelatedCompanies | LG INNOTEK CO., LTD JUN EUI GEUN |
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Snippet | Disclosed is a light emitting device module including a package body, a first lead frame and a second lead frame provided on the package body, a light emitting... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Light emitting device module |
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