Metal gate structures for CMOS transistor devices having reduced parasitic capacitance

A method of forming a field effect transistor (FET) device includes forming a gate structure over a substrate, the gate structure including a wide bottom portion and a narrow portion formed on top of the bottom portion; the wide bottom portion comprising a metal material and having a first width tha...

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Main Authors ROBISON ROBERT R, CAI JIN, PEI CHENGWEN, WANG PINGUAN
Format Patent
LanguageEnglish
Published 26.08.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract A method of forming a field effect transistor (FET) device includes forming a gate structure over a substrate, the gate structure including a wide bottom portion and a narrow portion formed on top of the bottom portion; the wide bottom portion comprising a metal material and having a first width that corresponds substantially to a transistor channel length, and the narrow portion also including a metal material having a second width smaller than the first width.
AbstractList A method of forming a field effect transistor (FET) device includes forming a gate structure over a substrate, the gate structure including a wide bottom portion and a narrow portion formed on top of the bottom portion; the wide bottom portion comprising a metal material and having a first width that corresponds substantially to a transistor channel length, and the narrow portion also including a metal material having a second width smaller than the first width.
Author WANG PINGUAN
PEI CHENGWEN
ROBISON ROBERT R
CAI JIN
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Snippet A method of forming a field effect transistor (FET) device includes forming a gate structure over a substrate, the gate structure including a wide bottom...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Metal gate structures for CMOS transistor devices having reduced parasitic capacitance
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