Copper containing algicidal compounds
The present application is directed to a coating composition comprising a ceramic binder and inorganic copper compound particles. Generally, the inorganic copper compound particles have a median particle size of less than 5 micrometers. In some embodiments, the particles have a median particle size...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
19.08.2014
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Subjects | |
Online Access | Get full text |
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Summary: | The present application is directed to a coating composition comprising a ceramic binder and inorganic copper compound particles. Generally, the inorganic copper compound particles have a median particle size of less than 5 micrometers. In some embodiments, the particles have a median particle size of greater than 1 micrometer. The inorganic copper compound particles may be non-photocatalytic. The coating may also be placed on a structural layer. |
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Bibliography: | Application Number: US20070444800 |