Copper containing algicidal compounds

The present application is directed to a coating composition comprising a ceramic binder and inorganic copper compound particles. Generally, the inorganic copper compound particles have a median particle size of less than 5 micrometers. In some embodiments, the particles have a median particle size...

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Bibliographic Details
Main Authors GOULD RACHAEL A. T, REYNOLDS KATHLEEN K, EVERMAN REBECCA L, KEISTER JAMIESON C
Format Patent
LanguageEnglish
Published 19.08.2014
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Summary:The present application is directed to a coating composition comprising a ceramic binder and inorganic copper compound particles. Generally, the inorganic copper compound particles have a median particle size of less than 5 micrometers. In some embodiments, the particles have a median particle size of greater than 1 micrometer. The inorganic copper compound particles may be non-photocatalytic. The coating may also be placed on a structural layer.
Bibliography:Application Number: US20070444800