Wafer level packaging of semiconductor chips
A method of manufacturing semiconductor packages at the wafer level is disclosed. A wafer has multiple integrated circuits (ICs) formed on its active surface, with each IC in communication with a plurality under-bump metallization (UBM) pads formed on one surface the package. The UBM pads include a...
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Format | Patent |
Language | English |
Published |
22.07.2014
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Subjects | |
Online Access | Get full text |
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Abstract | A method of manufacturing semiconductor packages at the wafer level is disclosed. A wafer has multiple integrated circuits (ICs) formed on its active surface, with each IC in communication with a plurality under-bump metallization (UBM) pads formed on one surface the package. The UBM pads include a larger pads near the center of package and smaller UBM pads near the periphery. The method includes attaching a stiffener to an inactive surface of the wafer; forming under bump metallization pads; and forming solder bumps extending from the UBM pads. |
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AbstractList | A method of manufacturing semiconductor packages at the wafer level is disclosed. A wafer has multiple integrated circuits (ICs) formed on its active surface, with each IC in communication with a plurality under-bump metallization (UBM) pads formed on one surface the package. The UBM pads include a larger pads near the center of package and smaller UBM pads near the periphery. The method includes attaching a stiffener to an inactive surface of the wafer; forming under bump metallization pads; and forming solder bumps extending from the UBM pads. |
Author | MCLELLAN NEIL ZBRZEZNY ADAM |
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Snippet | A method of manufacturing semiconductor packages at the wafer level is disclosed. A wafer has multiple integrated circuits (ICs) formed on its active surface,... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Wafer level packaging of semiconductor chips |
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