Optical component

In an optical component configured to fix to a mount an optical device chip in which waveguide type optical devices having different thermal expansion coefficients are butt-jointed, deterioration in reliability due to thermal stress is suppressed. The optical component (300) comprises an optical dev...

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Main Authors FUKUMITSU TAKAO, TERUI HIROSHI, TSUZUKI KEN, KIKUCHI YUICHI, GOH TAKASHI, SHIBAZAKI TOMOYO, MINO SHINJI, SAIDA TAKASHI, YAMAZAKI HIROSHI, ISHII MOTOHAYA, MURASAWA ATSUSHI, EBISAWA FUMIHIRO, YAMADA TAKASHI, DOI YOSHIYUKI
Format Patent
LanguageEnglish
Published 13.05.2014
Subjects
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Summary:In an optical component configured to fix to a mount an optical device chip in which waveguide type optical devices having different thermal expansion coefficients are butt-jointed, deterioration in reliability due to thermal stress is suppressed. The optical component (300) comprises an optical device chip (310) including an LN waveguide (311), a first PLC waveguide (312), a second PLC waveguide (313), and a fiber alignment member (314), a mount (320), and optical fibers (330). Each of connection faces between the first PLC waveguide and the fiber alignment member is configured as an tilted structure, and each of connection faces between the LN waveguide, and the first and second PLC waveguides is configured as a right-angled structure. In the right-angled structure, the connection faces are connected by an adhesive having a lower Young's modulus than that of an adhesive used on the connection faces of the tilted structure.
Bibliography:Application Number: US201113813388