Method of manufacturing semiconductor device having surface protective films on bond pad

• Main Authors: TAKATA YOSHIFUMI, HONMA TAKURO
• Format: Patent
• Language: English
• Published: 06.05.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide: a technique capable of suppressing a titanium nitride film that is exposed at the side surface of an opening from turning into a titanium oxide film even when water permeates the opening over a pad from outside a semiconductor device and thus improving the reliability of the semiconducto...