Semiconductor device substrate and semiconductor device
There is provided a semiconductor device substrate including: a multi-layer wiring layer; a first capacitor pad which is provided on an uppermost layer of the multi-layer wiring layer, and which includes a first power supply pad connected to a power supply layer of the multi-layer wiring layer throu...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
25.02.2014
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Subjects | |
Online Access | Get full text |
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