Flexible copper clad laminate
In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide...
Saved in:
| Main Authors | , , , , |
|---|---|
| Format | Patent |
| Language | English |
| Published |
15.10.2013
|
| Subjects | |
| Online Access | Get full text |
Cover
| Abstract | In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni-Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni-Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible copper clad laminate. |
|---|---|
| AbstractList | In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni-Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni-Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible copper clad laminate. |
| Author | FUJISAWA SATOSHI HATTORI KOICHI UNO TAKEO KUWASAKI NAOYA SUZUKI YUJI |
| Author_xml | – fullname: UNO TAKEO – fullname: HATTORI KOICHI – fullname: KUWASAKI NAOYA – fullname: FUJISAWA SATOSHI – fullname: SUZUKI YUJI |
| BookMark | eNrjYmDJy89L5WSQdctJrchMyklVSM4vKEgtUkjOSUxRyEnMzcxLLEnlYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocEWpqbmxpZGTkbGRCgBAFGTJZU |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| ExternalDocumentID | US8557392B2 |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_US8557392B23 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 15:21:48 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_US8557392B23 |
| Notes | Application Number: US200913055375 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20131015&DB=EPODOC&CC=US&NR=8557392B2 |
| ParticipantIDs | epo_espacenet_US8557392B2 |
| PublicationCentury | 2000 |
| PublicationDate | 20131015 |
| PublicationDateYYYYMMDD | 2013-10-15 |
| PublicationDate_xml | – month: 10 year: 2013 text: 20131015 day: 15 |
| PublicationDecade | 2010 |
| PublicationYear | 2013 |
| RelatedCompanies | FUJISAWA SATOSHI HATTORI KOICHI NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD UNO TAKEO FURUKAWA ELECTRIC CO., LTD KUWASAKI NAOYA SUZUKI YUJI |
| RelatedCompanies_xml | – name: FURUKAWA ELECTRIC CO., LTD – name: FUJISAWA SATOSHI – name: NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD – name: UNO TAKEO – name: KUWASAKI NAOYA – name: SUZUKI YUJI – name: HATTORI KOICHI |
| Score | 2.847618 |
| Snippet | In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING |
| Title | Flexible copper clad laminate |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20131015&DB=EPODOC&locale=&CC=US&NR=8557392B2 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFPVNp-LUSR-kb8VmS7r1oQj9Ygj7wK2yt5GkKRRGV7aK_76X0k1f9C0k5JJc-N1dkrsLwHMqiLA5IRZqB2VR7nLLdWVqSZVhB2antI6tmkydcULfVmzVgvwQC1PnCf2qkyMioiTivarldflziRXWvpX7F5Fj1fY1Xnqh2ZyOCRorhJmh70XzWTgLzCDwkoU5ffdGjA3RFPBRWp_02cDRGI4-fB2UUv7WKPElnM6RWFFdQUsVHTgPDh-vdeBs0rx3Y7GB3v4aerFOXSk2ypDbslQ7Q254auB-5gUSugEjjpbB2MJx1sc1rZPFcUaDW2jjUV_dgSFVPyMqo0JSQR0lOHW0M9jIlTyj3FZd6P5J5v6ftge40MzRMpewR2hXu0_VQ2VaiaeaDd-zl3oy |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1RS8MwED7GFOebTsWp0z5I34qLpt36UIS1K1PXbrhO9laSNIXC6MpW8e97Dd30Rd9CQi7Jhe8ul9xdAO4TTniPEWKgdpAGZTYzbFskhpApdjB7CVWxVUFojRf0dWkuG5DtYmFUntAvlRwRESUQ76WS18XPJZanfCu3DzzDqvWzHzmeXlvHBA8rxNS9oTOaTb2pq7uus5jr4bszMM0-HgWGKK0PEP8DZbN9DKuglOK3RvFP4HCGxPLyFBoyb0PL3X281oajoH7vxmINve0ZdP0qdSVfSU2si0JuNLFiiYb7meVI6Bw0fxS5YwPHifdrihfz_YyeLqCJpr68BE3Ix5TIlHJBObUkZ9SqnMEGtmApZT3Zgc6fZK7-abuD1jgKJvHkJXy7huOKUZX8JeYNNMvNp-yiYi35rWLJN52cfSk |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Flexible+copper+clad+laminate&rft.inventor=UNO+TAKEO&rft.inventor=HATTORI+KOICHI&rft.inventor=KUWASAKI+NAOYA&rft.inventor=FUJISAWA+SATOSHI&rft.inventor=SUZUKI+YUJI&rft.date=2013-10-15&rft.externalDBID=B2&rft.externalDocID=US8557392B2 |