Self aligned structures and design structure thereof

Vertical bipolar junction structures, methods of manufacture and design structures. The method includes forming one or more sacrificial structures for a bipolar junction transistor (BJT) in a first region of a chip. The method includes forming a mask over the one or more sacrificial structures. The...

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Main Authors SHI YUN, CLARK, JR. WILLIAM F, ZHANG YANLI, PEKARIK JOHN J
Format Patent
LanguageEnglish
Published 08.10.2013
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Abstract Vertical bipolar junction structures, methods of manufacture and design structures. The method includes forming one or more sacrificial structures for a bipolar junction transistor (BJT) in a first region of a chip. The method includes forming a mask over the one or more sacrificial structures. The method further includes etching an opening in the mask, aligned with the one or more sacrificial structures. The method includes forming a trench through the opening and extending into diffusion regions below the one or more sacrificial structures. The method includes forming a base region of the BJT by depositing an epitaxial material in the trench, in contact with the diffusion regions. The method includes forming an emitter contact by depositing a second epitaxial material on the base region within the trench. The epitaxial material for the emitter region is of an opposite dopant type than the epitaxial material of the base region.
AbstractList Vertical bipolar junction structures, methods of manufacture and design structures. The method includes forming one or more sacrificial structures for a bipolar junction transistor (BJT) in a first region of a chip. The method includes forming a mask over the one or more sacrificial structures. The method further includes etching an opening in the mask, aligned with the one or more sacrificial structures. The method includes forming a trench through the opening and extending into diffusion regions below the one or more sacrificial structures. The method includes forming a base region of the BJT by depositing an epitaxial material in the trench, in contact with the diffusion regions. The method includes forming an emitter contact by depositing a second epitaxial material on the base region within the trench. The epitaxial material for the emitter region is of an opposite dopant type than the epitaxial material of the base region.
Author SHI YUN
CLARK, JR. WILLIAM F
PEKARIK JOHN J
ZHANG YANLI
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INTERNATIONAL BUSINESS MACHINES CORPORATION
CLARK, JR. WILLIAM F
PEKARIK JOHN J
ZHANG YANLI
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Snippet Vertical bipolar junction structures, methods of manufacture and design structures. The method includes forming one or more sacrificial structures for a...
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ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Self aligned structures and design structure thereof
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