Methods for fabricating planar heater structures for ejection devices

• Main Authors: GUAN YIMIN, JOYNER, II BURTON, REITMEIER ZACH
• Format: Patent
• Language: English
• Published: 24.09.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CORRECTION OF TYPOGRAPHICAL ERRORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; PERFORMING OPERATIONS; PRINTING; SELECTIVE PRINTING MECHANISMS; SEMICONDUCTOR DEVICES; STAMPS; TRANSPORTING; TYPEWRITERS

Methods and apparatus teach a substrate wafer having a plurality of plugs configured there within. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patte...