Co-axial restraint for connectors within flip-chip packages

An assembly can include a microelectronic element such as, for example, a semiconductor element having circuits and semiconductor devices fabricated therein, and a plurality of electrical connectors, e.g., solder balls attached to contacts of the microelectronic element. The connectors can be surrou...

Full description

Saved in:
Bibliographic Details
Main Authors FITZSIMMONS JOHN A, FAROOQ MUKTA G
Format Patent
LanguageEnglish
Published 13.08.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

Abstract An assembly can include a microelectronic element such as, for example, a semiconductor element having circuits and semiconductor devices fabricated therein, and a plurality of electrical connectors, e.g., solder balls attached to contacts of the microelectronic element. The connectors can be surrounded by first, inner regions 200 of compressible dielectric material and second, outer regions of dielectric material. In one embodiment, an underfill can contact a face of the microelectronic element between respective connectors or second regions. The second regions can provide restraining force, such that during volume expansion of the connectors, the first regions can compress against the restraining force of the second regions.
AbstractList An assembly can include a microelectronic element such as, for example, a semiconductor element having circuits and semiconductor devices fabricated therein, and a plurality of electrical connectors, e.g., solder balls attached to contacts of the microelectronic element. The connectors can be surrounded by first, inner regions 200 of compressible dielectric material and second, outer regions of dielectric material. In one embodiment, an underfill can contact a face of the microelectronic element between respective connectors or second regions. The second regions can provide restraining force, such that during volume expansion of the connectors, the first regions can compress against the restraining force of the second regions.
Author FITZSIMMONS JOHN A
FAROOQ MUKTA G
Author_xml – fullname: FITZSIMMONS JOHN A
– fullname: FAROOQ MUKTA G
BookMark eNrjYmDJy89L5WSwds7XTazITMxRKEotLilKzMwrUUjLL1JIzs_LS00uyS8qVijPLMnIzFNIy8ks0E3OyCxQKEhMzk5MTy3mYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxUBlqXmpJfGhwRamBubGRqZORsZEKAEAZyExCw
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US8507325B2
GroupedDBID EVB
ID FETCH-epo_espacenet_US8507325B23
IEDL.DBID EVB
IngestDate Fri Jul 19 15:26:11 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US8507325B23
Notes Application Number: US20100695312
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130813&DB=EPODOC&CC=US&NR=8507325B2
ParticipantIDs epo_espacenet_US8507325B2
PublicationCentury 2000
PublicationDate 20130813
PublicationDateYYYYMMDD 2013-08-13
PublicationDate_xml – month: 08
  year: 2013
  text: 20130813
  day: 13
PublicationDecade 2010
PublicationYear 2013
RelatedCompanies INTERNATIONAL BUSINESS MACHINES CORPORATION
FITZSIMMONS JOHN A
FAROOQ MUKTA G
RelatedCompanies_xml – name: INTERNATIONAL BUSINESS MACHINES CORPORATION
– name: FAROOQ MUKTA G
– name: FITZSIMMONS JOHN A
Score 2.8998053
Snippet An assembly can include a microelectronic element such as, for example, a semiconductor element having circuits and semiconductor devices fabricated therein,...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Co-axial restraint for connectors within flip-chip packages
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130813&DB=EPODOC&locale=&CC=US&NR=8507325B2
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1bS8MwFD6MKeqbTsV5Iw_St-LWmxlShKYrQ9gFt8reRpOlWJS22Ir-fE9CN33Rh0BI4JCEnMuX5OQDuLEdz-tJLzXXTipMLNwccEQpLhVr6iLk4pbKdx5PvFHsPC7dZQuyTS6M_if0U3-OiBolUN9rba_Ln0OsUL-trG55hk3FQ7TwQ6NBx2iQad82wsAfzqbhlBmM-fHcmDz5FOMe23IDtNY7GEXfKWUYPgcqKaX87VGiQ9idobC8PoKWzDuwzzbEax3YGzf33VhtVK86hntWmMkX7hai2DQUsUNNMOAkQr1U0Zw5RJ2pZjlJ37LSFC9ZSXBqr2gvqhMg0XDBRiaOYrWd8Sqeb8drn0I7L3J5BkQRdA6klaS8lzge5Qg1-lIKW1KHcsG9LnT_FHP-T98FHFia5AHxpH0J7fr9Q16hq635tV6kb7LDhFg
link.rule.ids 230,309,783,888,25576,76876
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1bS8MwFD6MKc43nYrzmgfpW3HrzQwpwtqVqbvhWtlbWbIUi9IWW9Gf70nYpi_6EAgJHJKQc_mSnHwAV6blOG3hJPrSSriOheldhijFpnxJbYRczJD5zqOxM4ish7k9r0G6zoVR_4R-qs8RUaM46nul7HXxc4jlq7eV5TVLsSm_C0LX11boGA0y7Zia33P704k_8TTPc6OZNn5yKcY9pmH30FpvYYR9I5Wh_9yTSSnFb48S7MH2FIVl1T7URNaEhrcmXmvCzmh1343VleqVB3Dr5friC3cLkWwaktihIhhwEi5fqijOHCLPVNOMJG9pofOXtCA4tVe0F-UhkKAfegMdRxFvZhxHs814zSOoZ3kmjoFIgs6uMBYJay8shzKEGh0huCmoRRlnTgtaf4o5-afvEhqDcDSMh_fjx1PYNRThA2JL8wzq1fuHOEe3W7ELtWDfEw-HSw
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Co-axial+restraint+for+connectors+within+flip-chip+packages&rft.inventor=FITZSIMMONS+JOHN+A&rft.inventor=FAROOQ+MUKTA+G&rft.date=2013-08-13&rft.externalDBID=B2&rft.externalDocID=US8507325B2