Thermal receiver elements and imaging assemblies

An imaging element has a substrate, an extruded, non-voided compliant layer and an image receiving layer. The extruded, non-voided compliant layer has a heat of fusion of equal to or greater than 0 and up to and including 45 joules/g of compliant layer as determined in a temperature range of from 25...

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Bibliographic Details
Main Authors DONTULA NARASIMHARAO, GILLMOR JEFFREY R, CHANG SOMSACK
Format Patent
LanguageEnglish
Published 07.05.2013
Subjects
CINEMATOGRAPHY
COLOUR PRINTING
ELECTROGRAPHY
ELECTROPHOTOGRAPHY
HOLOGRAPHY
LINING MACHINES
MAGNETOGRAPHY
PERFORMING OPERATIONS
PHOTOGRAPHY
PHYSICS
PRINTING
PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:An imaging element has a substrate, an extruded, non-voided compliant layer and an image receiving layer. The extruded, non-voided compliant layer has a heat of fusion of equal to or greater than 0 and up to and including 45 joules/g of compliant layer as determined in a temperature range of from 25° C. to 147° C. by ASTM method D3418-08 and a tensile modulus value of less than 5×1010 dynes/cm2. These imaging elements can be used as thermal dye image transfer receiver elements to provide an image in combination with a thermal dye donor element in a thermal dye transfer process.
Bibliography:Application Number: US20100823187