Integrated circuit card

• Main Authors: LIANG JIMMY, CHU TSE MIN
• Format: Patent
• Language: English
• Published: 09.04.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

An integrated circuit card includes a laminate, solder bumps, a die and a package. The laminate includes a core board sandwiched between two conductive layers. The conductive layers are connected to each other with solder bumps filled in apertures defined in the core board. The die is provided on on...